Wafer Thickness Measurement

Wafer thickness measurement is critical for ensuring the quality, uniformity, and performance of semiconductor wafers. Atometrics develops high-precision non-contact optical systems to measure wafer thickness with nanometer-level accuracy and excellent repeatability.

High-Precision Non-Contact Thickness Measurement

Atometrics wafer thickness measurement systems use white light interferometry, confocal microscopy, and optical profilometry to deliver accurate thickness and topography measurements. Non-contact measurement ensures no surface damage while providing fast and reliable results for high-volume production and research applications.

Applications

Our wafer thickness measurement systems are widely used in:

• Semiconductor wafer and MEMS device inspection
• Thin film and coating thickness evaluation
• Precision optics and microfabrication analysis
• Automotive and aerospace microcomponent inspection
• Material science and research laboratories

Advantages of Atometrics Wafer Thickness Measurement Systems

• Non-contact measurement with nanometer-level precision
• High-speed scanning and automated data acquisition
• Accurate thickness and surface uniformity evaluation
• Supports wafers of various materials and sizes
• User-friendly software interface for visualization, reporting, and analysis

Why Choose Atometrics

Atometrics is a specialist in high-precision measuring instruments, combining advanced optical metrology, imaging sensors, and intelligent software. Our wafer thickness measurement systems provide reliable, accurate, and repeatable data to ensure quality control, yield optimization, and research accuracy.

Atometrics – High-Precision Wafer Thickness Measurement Systems for Semiconductor and Precision Manufacturing Applications.