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Home - Product Center - Roughness/Step Height - IC Substrate 3D Inspection Solutions EP Series
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IC Substrate 3D Inspection Solutions EP Series
Roughness/Step Height
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    IC Substrate 3D Inspection Solutions EP Series
    Roughness/Step Height
  • Overview
  • Application examples
  • Download
    • Consult Now
    IC Substrate 3D Inspection Solutions EP Series
    One stop packaging substrate 3D inspection solution
    Roughness Flatness 3D topography
    Ultra fast scanning speed: 35um/s (up to 400um/s) vertical scanning speed, which is 5 times faster than traditional models; Fully automatic measurement: minimalist operation, easy online programming settings, automatic measurement; Offline analysis: raw
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      Boardstone lntelligent(Shenzhen)Co.,Ltd.

      14F,Building C Kaifa Plaza, 7006 Caitian Rd., Futian Dist. Shenzhen

      Hotline：400 080 3885
      Sales@atometrics.com.cn

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