Wafer Thickness/TTV/Warpage Solution APS series

Wafer Thickness/TTV/Warpage Solution APS series

Roughness/Step Height/Thickness

Product characteristics

Application examples

Wafer Thickness/TTV/Warpage Solution APS series

Roughness/Step Height/Thickness

Product characteristics

Application examples

Wafer Thickness/TTV/Warpage Solution APS series

It is suitable for overall thickness detection and TTV/BOW/Warp and other parameter detection of silicon wafer Si and compound (GaAs, InP, SiC, GaN) samples. The equipment is compatible with transparent and opaque wafers.

High-precision High Scan Speed Intelligent Automation

It adopts non-contact measurement method, accurate measurement and fast testing. It adopts white light source and upper and lower double probe design. When testing, the sample is placed in the middle of the upper and lower probes. One test can quickly pro

Product characteristics

Fully automatic measurement

Extremely simple operation, easy online programming, automatic measurement, mapping mode

Powerful measurement capabilities

All data can be obtained simultaneously in one test: thickness, TTV, Bow, Warp, TIR, LTV, etc.

Fast measurement speed

Support flying point sampling, quickly complete measurement, save production time

Wide range of application scenarios

The APS series can adapt to a variety of different products, different scenarios, and different needs, providing you with the best solution

Application examples

Semiconductor

Glass substrate

Sapphire crystal