Copper Clad Laminate Thickness Measurement

Copper clad laminate (CCL) thickness measurement is essential in printed circuit board (PCB) manufacturing to ensure proper laminate and copper layer thickness. Atometrics develops advanced non-contact optical metrology systems that provide accurate and repeatable measurements for copper clad laminates and multilayer boards.

High-Precision Non-Contact Measurement

Atometrics CCL thickness measurement systems use white light interferometry and optical profilometry to achieve micron- and nanometer-level accuracy. Non-contact measurement ensures sensitive laminated materials remain undamaged while delivering reliable results for production and R&D.

Applications

Our CCL thickness measurement systems are widely applied in:

• PCB and multilayer board thickness verification
• Copper layer and laminate uniformity assessment
• High-frequency and precision electronics inspection
• Material science and R&D laboratories
• Quality control in industrial PCB production

Advantages of Atometrics Copper Clad Laminate Thickness Measurement Systems

• Non-contact optical measurement protects sensitive laminates
• High-resolution thickness evaluation with nanometer precision
• Automated scanning and intelligent analysis of laminate uniformity
• Supports different board sizes and multilayer structures
• User-friendly software for visualization, reporting, and data management

Why Choose Atometrics

Atometrics specializes in high-precision measuring instruments. Our copper clad laminate thickness measurement systems provide accurate, reliable, and repeatable results for industrial, R&D, and precision electronics applications.

Atometrics – High-Precision Copper Clad Laminate Thickness Measurement for PCB Manufacturing and R&D.