Wafer 3D Inspection WM Series

1. Principle of Wafer 3D Inspection WM Series

The Wafer 3D Inspection WM Series is based on the White Light Interferometry (WLI) principle. Interference fringes are generated when the optical path length from the light reflected off the object surface equals that from the internal reference mirror. A nanometer-level piezoelectric ceramic moves the optical path to acquire the phase difference of the interference fringes, which is converted into height (h) and resolved into a 3D height topography.

2. Applications of Wafer 3D Inspection WM Series

The Wafer 3D Inspection WM Series can measure:

Wafer roughness (minimum measurable roughness 0.03 nm, compliant with ISO 25178 and ISO 4287 standards); Step height (maximum measurable step height 5000 µm, step height accuracy up to 0.3%); Wafer dicing/cutting depth; Dimensions related to photomasks/reticles;Dimensions related to bumping.

It is widely used in semiconductor manufacturing processes such as silicon ingot cutting, grinding & thinning, photomask/reticle fabrication, etching, dicing, marking, and bumping. It is also suitable for scenarios like consumables inspection and equipment experimentation.

3. Features and Advantages of Atometrics's Wafer 3D Inspection WM Series

Main Features:

1. Surface Roughness Measurement: Measures wafer roughness, complying with international standards.
2. Step Height Measurement: Measures step heights up to 5000 µm, with accuracy up to 0.3%.
3. Topography Observation: Detailed 3D imaging for observing and measuring wafer surface topography.

Equipment Advantages:

1. High Measurement Accuracy: Based on white light interferometry, achieves < 1 nm detection accuracy, with roughness RMS repeatability of 0.005 nm.
2. High Speed: Measurement unit maximum scanning speed 400 µm/s, stage speed 300 mm/s.
3. Strong Applicability: Handles 4-inch to 12-inch wafers, features one-click vacuum chucking, and achieves vibration resistance grade VC-D.
4. Powerful Software: Simple programming, concise interface, automatic report generation, SDK open for customization.

Wafer 3D Metrology WPM Series

1. Principle of Wafer 3D Metrology WPM Series:

1. White Light Interferometry Principle: Uses a coherent light scanning imaging method, precisely reconstructing micro-topography through the layering and superposition of interference images. Achieves < 1 nm detection accuracy at any magnification.
2. Film Thickness Measurement Principle: As light waves of different wavelengths penetrate the film layer under test, the phase difference of the reflected light from the upper and lower surfaces changes. The thickness of the measured film layer is calculated by analyzing the interference pattern.

2. Applications of Wafer 3D Metrology WPM Series

The Wafer 3D Metrology WPM Series can measure:

Step height, film thickness, critical dimensions (CD), overlay accuracy, Warpage/Bow/Stress, Roughness, EBR (Edge Bead Removal), etc. In advanced packaging, it can measure the height, roughness, line width, line spacing, and line height of copper pillars, RDL (Redistribution Layer), UBM (Under Bump Metallization), bumps, etc. Can measure the profile of CMP (Chemical Mechanical Planarization/Polishing) processes.

It is widely used throughout the integrated circuit manufacturing flow, including IC design, wafer manufacturing stages, advanced packaging processes, and test processes. It covers steps such as lithography, etching, ion implantation, wafer dicing, electroplating, CMP, cleaning, and incoming/outgoing inspection.

3. Features and Advantages of Atometrics's Wafer 3D Metrology WPM Series:

Main Features:

1. Comprehensive Measurement Functions: Measures step height, film thickness, critical dimensions, overlay accuracy, etc.
2. Customization: Measurement functions can be customized according to requirements.

Equipment Advantages:

1. High Measurement Accuracy: Topography repeatability 0.03 nm, step height accuracy 0.3%, XY maximum repeat precision 0.19 µm.
2. High Inspection Efficiency: Ultra-fast scanning speed (5x faster than traditional models), fully automated measurement, convenient offline analysis.
3. Advanced Technology: Combines three techniques in one: White Light Interferometry, Spectral Reflectometry, and Confocal Chromatic Sensing. Full-range piezoelectric ceramic scanning.
4. Superior Hardware: Utilizes high numerical aperture white light interference objectives, nanometer-level piezoelectric ceramics, and offers excellent vibration isolation.