Wafer 3D Inspection Solutions WM Series | Atometrics WM Series Automated 3D Wafer Topography, Wafer Warpage/Bow/TTV/STRESS Analysis - Atometrics

Wafer 3D inspection solutions WPM Series

Roughness/Step Height/Thickness

Product characteristics

Application examples

Wafer 3D inspection solutions WPM Series

Roughness/Step Height/Thickness

Product characteristics

Application examples

Wafer 3D inspection solutions WPM Series

One stop solution for wafer 3D measurement system to meet the full process measurement requirements

Roughness Film thickness 3D topography Height difference

White light interference, spectral reflection, and spectral confocal three in one! Programming measurement: intelligent array, automatic measurement, automatic focusing, automatic positioning Data Feedback database management; High usability, automatic

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Product characteristics

Multi-functional measurement tools

Roughness/Film thickness/Step Height/Dimensional size/Warpage/Bow/Stress

Ultra high precise

RMS repeatability 0.03 nm

1- σ step accuracy 0.3%

XY Maximum repeatability 0.19μm

Ultra-high inspection efficiency

Ultra-fast scanning speed, 5 times that of traditional models
Fully automatic measurement
Offline analysis: raw data can be retrieved for secondary specific analysis

Application examples

Wafer inspection

Membrane thickness

CMP surface profile

Wafer Warp/Bow/TTV/Stress

CD/RDL/EBR Width

Pilar/RDL Height

Engraving accuracy

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One stop wafer 3D inspection solutions WPM Series

Product Catalog

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